51th Annual Congress
Ho Chin Minh City, Vietnam
The 51st APDSA Annual Congress was held from 2nd to 6th July 2025 in Ho Chi Minh City, Vietnam, hosted by the University of Medicine and Pharmacy at Ho Chi Minh City. This prestigious event brought together dental students and professionals from across the Asia-Pacific region for a week of academic exchange, clinical skill enhancement, and cross-cultural networking.
Representing the Malaysian Division, a delegation of 13 students participated in the Congress. The delegates were Chen Jia Huey, Loo Jing Thong, Stephanie Hooi Kah Wai, Winnie Hau Huey Nie, Ang Hui Tian, Teh Ke Li, Nur Arrissa Aqilla Bt Shahriman, Koh Wei Li, Sharrmaa A/L Ramachandran, Low Swee Ling, K’ng Xing Ying, Koh Jia Xuan, and Chen Qi Hui.
Throughout the Congress, attendees took part in a series of insightful lectures delivered by esteemed speakers, revolving around topics like Digital Dentistry, Implantology, Periodontology, and Lasers.
The Malaysian delegates performed exceptionally in various academic competitions. Koh Wei Li secured First Place in the Scientific Research Competition – Clinical Research Category, while Low Swee Ling achieved First Place in the Basic Science Research Category. Stephanie Hooi Kah Wai claimed First Place in the Mini Quiz held during the Welcoming Dinner, and alongside Winnie Hau Huey Nie and Loo Jing Thong, attained Fourth Place in the APDSA XC Academic Quiz. Notably, Koh Wei Li was also appointed as APDSA International President Elect, a proud achievement for Malaysia.
Beyond the academic and competitive components, the Congress also provided a platform to explore Vietnam’s vibrant culture and to foster lasting friendships and professional connections among dental students from diverse backgrounds.
As the Congress concluded on a high note, we look forward to continuing this legacy. As Malaysia will be the host for the 52nd APDSA Annual Congress in 2026, and we warmly await the arrival of all delegates to our home country for another inspiring and memorable gathering.
